With an increase in heat generated by motherboard components over the years, SilverStone has focused on providing solutions to keep the components around the CPU socket cool. The initial product aimed at addressing this issue was the FDP01, a fan adapter bracket that mounts directly to the rear chassis fan. This bracket allows for the installation of two additional fans that blow air directly onto motherboard's VRM. Recognizing that the heat produced by new-generation M.2 SSDs and memory sticks is also increasing, SilverStone developed a concept that enables users to direct airflow to any desired component around the CPU socket in the form of an upgrade fan kit called IMF70 ARGB for the IceMyst series of AIO CPU coolers launched in 2023. SilverStone also took note of the disadvantage of installing AIO liquid coolers in comparison to air coolers, which often results in inadequate airflow reaching the hotspot components around the CPU socket. To address this, IMF70-ARGB can be stacked on top of the IceMyst series of cooler pump blocks. Additionally, it is equipped with 320 degree mobility, allowing users to direct airflow toward various areas such as the motherboard VRMs, M.2 SSD slot, memory slots, and more. Stacking multiple IMF70-ARGB fans on the pump block is possible, as long as it remains within the tolerance limits of the motherboard header or the size of the case.